Techniques¶
Each page explains what a method measures or makes, how it works, what it cannot do, and which instrument at the MPaCT Lab in Flagstaff, Arizona performs it.
Start here if you already know the method, or if you know you need an electron microscope or a surface-area measurement but not which machine. If you have a sample in hand, start by sample type. If you are choosing between two methods, start with a comparison. If you already know the make and model, use Instruments.
Characterization - what is this material?¶
| Technique | Answers | Instrument |
|---|---|---|
| Transmission Electron Microscopy | Internal structure, crystallography, composition below 0.2 nm | JEOL JEM-F200 |
| Scanning Electron Microscopy | Surface morphology and elemental composition to about 1 nm | JEOL JSM-IT710HR |
| Focused Ion Beam (DualBeam) | Site-specific milling, cross-sections, and TEM lamellae | FEI Quanta 3D FEG DualBeam |
| Atomic Force Microscopy | Calibrated surface height and roughness in nanometres, 50 × 50 µm | AFM Workshop B-2 |
| Optical Profilometry | Non-contact 3D roughness and step height up to 50 × 50 mm | Keyence VK-X3000 |
| Spectroscopic Ellipsometry | Thin-film thickness and optical constants, without contact | J.A. Woollam RC2 |
| Photoluminescence Spectroscopy | Emission spectra and lifetimes from UV to mid-IR | Edinburgh Instruments FLS1000 |
| X-ray Diffraction | Crystal phase, texture, film thickness by reflectivity | Rigaku SmartLab |
| Secondary Ion Mass Spectrometry | Trace composition versus depth | Hiden SIMS Workstation |
| Gas Sorption and BET | Specific surface area, pore size distribution, pore volume | Microtrac BELSORP MAX X |
| Sample Degassing | Clean surface before an adsorption measurement | Microtrac BELPREP VAC |
| On-Wafer Probing | I–V, C–V, RF, and mmWave on wafers up to 200 mm | MPI TS200 |
| Digital Microscopy | Colour inspection and on-screen 2D measurement | Keyence VHX-7000 |
| Wide-Area Coordinate Measurement | GD&T and laser scan of parts too large for a benchtop CMM | Keyence WM-6000 |
| Impedance Analysis | C, L, R, and Z versus frequency, 20 Hz to 120 MHz | Keysight E4990A |
| Vector Network Analysis | Two-port S-parameters of 50 Ω networks | Keysight E5063A |
| Cryogenic Electrical and Optical Measurement | Transport and optical access from 3.2 K to 350 K | Montana CryoAdvance 50; Rutherford Titan 10 LN2 |
| Seebeck Coefficient and Resistivity | Thermoelectric S and four-terminal ρ versus temperature | LINSEIS LSR-3 |
| Benchtop Electrical Measurement | DMM, function generator, and 50 MHz oscilloscope | Keithley 2110, Tektronix AFG1022, TBS1052C |
| Spatial Light Modulation | Phase-only wavefront control, 400–850 nm | Thorlabs EXULUS-HD2HP |
Testing and calibration - will it survive, and can I trust the reading?¶
| Technique | Answers | Instrument |
|---|---|---|
| Environmental Stress Testing | Whether a device survives temperature and humidity stress | CSZ MicroClimate MCBH-1.2 |
| Pressure Calibration | Whether a pressure instrument reads true, against a primary standard | Fluke Calibration P3114 |
Fabrication - how do I make this part?¶
| Technique | Answers | Instrument |
|---|---|---|
| Fused Deposition Modeling | Building a part additively, including geometry no cutter can reach | Bambu Lab H2D |
| CNC Machining | Cutting a part from dense stock to a tolerance | Haas Desktop Mill, Haas Desktop Lathe |
| Laser Micromachining | Structuring, drilling, and cutting electronics substrates with a picosecond laser | LPKF ProtoLaser R4 |
| Photolithography | Transferring a photomask into resist at 0.5–1.0 µm | SUSS MJB4 |
| Nanoimprint Lithography | Replicating a stamp into resist, ~40 nm to >100 µm | NIL Technology CNI v3.0 |
| Die Attach and Wire Bonding | Packaging a die and connecting its pads with gold wire | Tresky T-4909-AE, West-Bond 7700D |
| Conductive-Ink PCB Printing | Additive 0.2 mm traces on a desktop printer | Voltera V-One |
| Wafer Scribing | Top-side scoring and cleaving, 5 mm to 300 mm | PELCO FlexScribe 300 |
| TEM Sample Preparation | Disk grind, dimple, and argon mill to electron transparency | Fischione 160, 200, 1051 |
Automation and control - how is the process run?¶
| Technique | Answers | Instrument |
|---|---|---|
| Industrial Automation and PLC Control | How a controller sequences a production line, and why sensors fail before code does | Amatrol 870 line, Smart Robot Workcell |
The equipment catalogue lists every tool, with live status and booking.
MPaCT Lab - Building 98E, South Engineering Lab, 561 E Pine Knoll Dr, Flagstaff, AZ 86001
Phone: 928-523-2343 · Email: mpct.nano@nau.edu