West·Bond 7700D Wire Bonder
A manual thermosonic ball-wedge wire bonder designed for precision microelectronic packaging. It utilizes ultrasonic energy and heat to create reliable gold wire interconnections between semiconductor dies and package leads.
System Capabilities
The West·Bond 7700D is a manual workstation that gives operators fine control over the interconnection process. It uses an 8:1 mechanical advantage manipulator, allowing for precise placement of ball and wedge bonds on micron-scale pads.
This system is specifically optimized for Thermosonic Bonding, combining ultrasonic energy with a heated stage (typically 100°C - 150°C) to form strong metallurgical bonds without damaging sensitive die structures.
Operating Modes
Ball-Wedge Bonding
Standard mode for connecting device pads (Ball) to package leads (Wedge) using Gold wire.
Manual XYZ Control
Operator-guided motion for repairing traces or bonding prototype devices with irregular layouts.
Stitch Bonding
Creating continuous chains of interconnects between multiple points on a hybrid assembly.
Programmable Logic
Onboard CPU stores specific power, time, and force settings for consistent repeatability.
Technical Specifications
| Bonding Method | Thermosonic (Heat + Ultrasonic) |
|---|---|
| Wire Compatability | Gold (0.7 - 2.0 mils diameter) |
| Ultrasonic Transducer | 63 kHz, 5W Dual-Channel |
| Z-Axis Travel | 0.5 inches |
| Throat Reach | 5.125 inches |
| Microscope | Stereo Zoom (External) |
Comparison: Wire Bonding vs. Soldering
Comparing thermosonic gold wire bonding against traditional electronics soldering methods.
| Feature | This Tool (Wire Bonding) | Traditional (Soldering) |
|---|---|---|
| Connection Scale | Micron Scale (~25 µm) | Millimeter Scale |
| Material | Pure Gold Wire | Lead/Tin Alloy Paste |
| Temperature | Localized Ultrasonic + Heat | Global Reflow / Direct Iron |
| Application | Die-to-Package (Inside Chip) | Component-to-Board (PCB) |
| Reversibility | Permanent | Reworkable |