Tresky T-4909-AE Die Bonder
A manual, high-precision micro-assembly system featuring True Vertical Technologyâ„¢ for parallel bonding. It supports a wide range of applications including MEMS, flip-chip, and adhesive die attach for R&D and pilot production.
System Capabilities
The T-4909-AE utilizes "True Vertical Technology," ensuring absolute parallelism between the chip and substrate at any bond height. This is critical for high-quality bonding in deep cavities or on multi-level packages.
It features a programmable force controller (20g to 1kg) and an air-cushioned stage, making it suitable for handling sensitive devices like MEMS, MOEMS, and VCSELs, as well as robust flip-chip assemblies.
Operating Modes
Manual Pick & Place
Precise X-Y-Z positioning using the air-cushioned stage with fine adjustment for general die sorting and assembly.
Epoxy Bonding
Die attach using time/pressure dispensing or stamping methods for adhesive application.
Eutectic Bonding
Thermocompression capability for Au-based and other eutectic processes (requires heating option).
Flip-Chip Assembly
Supports flip-chip placement with optional optical alignment for high-accuracy interconnects.
Technical Specifications
| Placement Accuracy | ± 10 µm (Operator Dependent) |
|---|---|
| Bond Force Range | 20 g – 1000 g (Programmable) |
| X-Y Stage Travel | 180 mm x 180 mm |
| Z-Axis Stroke | 95 mm (Manual) |
| Spindle Rotation | 360° Unlimited |
| Control Interface | Integrated Raspberry PC Touchscreen |
| Dimensions | 755 mm x 730 mm x 500 mm |
Comparison: Manual vs. Automated Bonding
Comparing the manual Tresky T-4909 against high-volume automated die bonders.
| Feature | Tresky T-4909 (Manual) | Automated Bonder |
|---|---|---|
| Flexibility | High (Rapid Changeover) | Low (Complex Setup) |
| Volume Suitability | R&D / Prototyping | High Volume Production |
| Process Control | Operator Guided | Machine Vision |
| Z-Height Range | Large (95 mm) | Limited |
| Cost | Budget Sensitive | High Capital Expense |