PELCO FlexScribe 300 Wafer Scriber
A manual wafer scribing system for clean, controlled scribe lines on brittle materials. It supports top-side scribing of wafers up to 300 mm and handles materials such as silicon, sapphire, and glass.
System Capabilities
The FlexScribe 300 provides manual scribing with controlled scribe length and repeatable alignment. It is designed for brittle and hard materials where clean, straight scribe lines are required before cleaving.
The tool supports a wide range of wafer sizes and can be used on silicon, sapphire, quartz, glass, and ceramics.
Operating Modes
Straight-Line Scribing
Manual scribing for clean, controlled break lines.
Adjustable Scribe Length
Set the scribe length for repeatable cuts.
Alignment Guides
Support precise alignment of wafers and samples.
Top-Side Scribing
Configured for top-side scribing on brittle materials.
Technical Specifications
| Wafer Size Range | 5 mm to 300 mm (12 in) |
|---|---|
| Scribing Method | Carbide scribing wheel |
| Scribing Orientation | Top-side scribing |
| Supported Materials | Silicon, sapphire, quartz, glass, ceramics |
| Operation | Manual wafer scribing |
| Use Case | Controlled scribe lines for clean cleaving |
Comparison: This System vs Conventional Alternative
A high-level comparison to highlight performance and workflow advantages.
| Feature | This System | Conventional Method |
|---|---|---|
| Precision | Higher accuracy and repeatability | Standard tolerance |
| Workflow | Streamlined and automated | Manual or multi-step |
| Throughput | Faster turnaround | Slower cycle time |