General Electrical Test

MPI TS200 Manual Probe System

A highly flexible manual probe system designed for analytical characterization of wafers up to 200 mm. It provides a stable, shielded platform for precision I-V/C-V, RF, and mmW measurements on semiconductor devices.

MPI TS200 Probe Station
Wafer Size Up to 200 mm (8")
Temp Range Ambient – 300°C
Stage Travel 205 x 205 mm
Capabilities DC, RF, & mmW

System Capabilities

The TS200 features a modular ShielDEnvironmentâ„¢ for EMI-shielded and light-tight measurements, crucial for low-noise electrical characterization. It supports substrates ranging from small fragments up to 8-inch wafers.

Equipped with independent X-Y-Z and theta controls, the stage ensures accurate alignment for contacting small features. The platen supports a wide variety of micro-positioners (magnetic or vacuum bases) for versatile testing setups.

Operating Modes

DC Probing

Standard I-V and C-V characterization requiring low-noise cables and a shielded environment for pA-level accuracy.

RF & mmW Probing

High-frequency S-parameter testing for filters, antennas, and high-speed circuits using specialized RF probes.

Thermal Testing

Characterizing electrical properties under thermal stress (Ambient to 300°C standard, expandable to -60°C).

Failure Analysis

Signal tracing on ICs to identify local defects or shorts, best performed with high-magnification optics.

Technical Specifications

Chuck Size 200 mm (8 inches)
X-Y Travel Range 205 mm x 205 mm
Chuck Z-Stroke 10 mm (for safe loading)
Chuck Planarity < 10 µm across 200 mm
Microscope Travel 50 mm x 50 mm (X-Y) with Z-lift
Platen Material Steel or Aluminum (High Rigidity)

Comparison: On-Wafer vs. Packaged Testing

Comparing manual on-wafer probing (TS200) against traditional packaged device testing.

Feature TS200 (On-Wafer Probe) Packaged Testing
Device State Bare Die / Wafer Encapsulated / Bonded
Feedback Speed Immediate (Fab Line) Delayed (After Packaging)
Cost per Test Low (No Package needed) Higher (Requires Packaging)
Interface Direct Micro-Probe Sockets / PCB Solder
Signal Integrity High (Minimal Parasitics) Variable (Package Parasitics)

Common Applications

Device Characterization Measuring I-V and C-V curves for transistors and diodes.
RF Components Testing filters, antennas, and comms components at high frequencies.
Reliability Testing Stress-testing devices to observe failure mechanisms over time.
Circuit Debugging Probing internal nodes of integrated circuits to isolate defects.