LPKF ProtoLaser R4
A precision picosecond laser system designed for material-friendly micro material processing.It enables high-precision structuring of thermally sensitive substrates with virtually no heat transfer, making it ideal for RF and microwave prototyping.
System Capabilities
The ProtoLaser R4 specializes in "cold ablation," a process that removes material without generating significant heat stress.This prevents micro-cracks and delamination, which is critical for processing sensitive RF laminates and ceramics.
It handles a wide variety of substrates including FR4, fired ceramics (Al2O3, LTCC), glass, and flexible polyimide foils.
Operating Modes
Laser Structuring
Ablation of copper/conductive layers to create circuit patterns with 20 µm spacing accuracy.
Cutting & Depaneling
Precision separation of individual boards from rigid, flex-rigid, or ceramic panels.
Drilling
Creation of micro-vias and through-holes in PCBs and ceramics.
Surface Processing
Removal of thin films (e.g., TCO/ITO) from glass or plastic without damaging the substrate.
Technical Specifications
| Laser Power | 8 W (Max) |
|---|---|
| Processing Area (X/Y/Z) | 305 mm × 229 mm × 7 mm |
| Positioning Accuracy | ± 8 µm (Scan Field) |
| Repeatability | ± 0.23 µm |
| Structuring Speed | ~3.5 cm²/min (18 µm Cu) |
| Control Software | LPKF CircuitPro PL |
Comparison: Laser vs. Traditional
Comparing the LPKF ProtoLaser (Picosecond Ablation) against standard Mechanical Milling methods.
| Feature | This System (Laser Ablation) | Traditional Method (Milling) |
|---|---|---|
| Thermal Stress | Negligible ("Cold" Process) | High (Friction Heat) |
| Substrate Contact | Contactless (No vibration) | Physical Contact (Vibration risk) |
| Precision (Line/Space) | High (20 µm / 35 µm) | Medium (~100 µm) |
| Geometry Limitations | Virtually Unlimited | Limited by Drill Bit Radius |
| Consumables | None (Laser Source) | Drill Bits / Routers |
Common Applications
Accessories
The following tools are accessories for the LPKF ProtoLaser R4, designed to complete the prototyping workflow through lamination, plating, and assembly.
Individual accessories may be available for lending, subject to availability.
To inquire about borrowing a specific accessory, please Contact
the Lab Manager.