LPKF ProtoLaser R4
A precision picosecond laser system designed for material-friendly micro material processing.It enables high-precision structuring of thermally sensitive substrates with virtually no heat transfer, making it ideal for RF and microwave prototyping.
System Capabilities
The ProtoLaser R4 specializes in "cold ablation," a process that removes material without generating significant heat stress.This prevents micro-cracks and delamination, which is critical for processing sensitive RF laminates and ceramics.
It handles a wide variety of substrates including FR4, fired ceramics (Al₂O₃, LTCC), glass, and flexible polyimide foils.
Operating Modes
Laser Structuring
Ablation of copper/conductive layers to create circuit patterns with 20 µm spacing accuracy.
Cutting & Depaneling
Precision separation of individual boards from rigid, flex-rigid, or ceramic panels.
Drilling
Creation of micro-vias and through-holes in PCBs and ceramics.
Surface Processing
Removal of thin films (e.g., TCO/ITO) from glass or plastic without damaging the substrate.
Technical Specifications
| Laser Power | 8 W (Max) |
|---|---|
| Processing Area (X/Y/Z) | 305 mm × 229 mm × 7 mm |
| Positioning Accuracy | ± 8 µm (Scan Field) |
| Repeatability | ± 0.23 µm |
| Structuring Speed | ~3.5 cm²/min (18 µm Cu) |
| Control Software | LPKF CircuitPro PL |
Comparison: Laser vs. Traditional
Comparing the LPKF ProtoLaser (Picosecond Ablation) against standard Mechanical Milling methods.
| Feature | This System (Laser Ablation) | Traditional Method (Milling) |
|---|---|---|
| Thermal Stress | Negligible ("Cold" Process) | High (Friction Heat) |
| Substrate Contact | Contactless (No vibration) | Physical Contact (Vibration risk) |
| Precision (Line/Space) | High (20 µm / 35 µm) | Medium (~100 µm) |
| Geometry Limitations | Virtually Unlimited | Limited by Drill Bit Radius |
| Consumables | None (Laser Source) | Drill Bits / Routers |
Common Applications
Accessories
The following tools are accessories for the LPKF ProtoLaser R4, designed to complete the prototyping workflow through lamination, plating, and assembly.
