Metrology Thin Film
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J.A. Woollam RC2 Ellipsometer

High-speed dual-rotating compensator spectroscopic ellipsometer for non-contact thin film characterization. Provides full Mueller-matrix data, mapping, and precision thickness and optical constants.

J.A. Woollam RC2 Ellipsometer
Spectral Range 210 to 1690/2500 nm
Mueller Matrix All 16 elements
Wavelengths >1000 channels
Sample Size Up to 200/300 mm

System Capabilities

The RC2 uses a dual-rotating compensator design to capture full Mueller-matrix data, enabling characterization of complex, anisotropic, or depolarizing samples.

High-speed acquisition allows more than 1000 wavelengths per measurement and supports automated mapping for uniformity checks across wafers or large substrates.

Operating Modes

Spectroscopic Ellipsometry

Thin film thickness and optical constant measurements (n, k).

Mueller-Matrix

Full 16-element Mueller matrix for complex materials.

Mapping

Spatial uniformity of thickness and optical constants.

In-Situ Monitoring

Real-time growth or etch rate monitoring (with integration).

Technical Specifications

Spectral Range UV-Vis-NIR (210 nm to 1690 nm or 2500 nm)
Detectors CCD (UV-Vis) and InGaAs (NIR)
Angle of Incidence Automated or manual, typically 45 to 90 deg
Data Acquisition ~0.1 to 3 seconds per measurement point
Wavelength Count >1000 channels per measurement
Sample Size Standard configurations up to 200 mm or 300 mm wafers
Sample Surface Reflective or semi-reflective surfaces preferred

Comparison: Ellipsometry vs. Stylus Profilometry

Comparing optical ellipsometry to traditional contact profilometry.

Feature This System (Ellipsometry) Traditional Method (Stylus Profilometer)
Measurement Method Non-contact optical polarization analysis Contact stylus traces surface topography
Data Output Thickness and optical constants (n, k) Step height and surface profile
Sample Impact Non-destructive, no surface contact Physical stylus contact with surface
Mapping Automated multi-point mapping Line scans with limited area coverage
Best Use Thin film characterization and optical properties Step height and roughness verification

Common Applications

Thin Film Thickness Thickness and optical constants for multilayer stacks.
Semiconductor and PV Gate oxides, TCOs, and absorber layer characterization.
Uniformity Mapping Wafer-scale thickness and n,k uniformity checks.
In-Situ Monitoring Real-time growth or etch rate monitoring.