General Reliability Test

CSZ Environmental Chamber

A compact benchtop environmental chamber designed for temperature and humidity cycling. It provides a controlled environment (-68°C to +190°C) for evaluating the reliability and stability of small electronics, materials, and assemblies.

CSZ MicroClimate Chamber
Temp Range -68°C to +190°C
Humidity Range 10% – 98% RH
Volume 1.2 ft³ (34 L)
Stability ± 0.5°C

System Capabilities

The MicroClimate MCBH-1.2 utilizes a cascade refrigeration system to achieve extremely low temperatures (-68°C) while maintaining a compact benchtop footprint. It features a steam generator and refrigerated wet coil for precise humidity control.

It is equipped with the CSZ EZT430S touchscreen controller, allowing users to define complex multi-step profiles with ramps, soaks, and alarm limits for automated reliability testing.

Operating Modes

Constant Temperature

Holds a fixed setpoint for steady-state exposure and soak tests across the full temperature range.

Thermal Cycling

Automated ramping between temperature setpoints to simulate thermal shock and evaluate life-cycle fatigue.

Temp + Humidity

Simultaneous control of Temp and RH (10-98%) for accelerated aging and moisture resistance testing.

Programmed Profiles

User-defined sequences with up to 64 steps, allowing for complex reliability screening protocols.

Technical Specifications

Workspace Volume 1.2 ft³ (Approx. 34 L)
Temperature Range -68°C to +190°C
Humidity Range 10% to 98% RH
Control Stability ± 0.5°C (-50°C to 190°C)
Live Load Capacity 175 W @ -40°C
Controller CSZ EZT430S Touchscreen
Power Requirement 115 V / 230 V Single Phase

Comparison: Environmental Chamber vs. Standard Oven

Comparing the CSZ MicroClimate against a standard laboratory heating oven.

Feature CSZ Chamber Standard Lab Oven
Cooling Capability Active Refrigeration (-68°C) None (Ambient only)
Humidity Control Active (Steam/Dehumidify) Uncontrolled (Ambient)
Cycling Speed Fast (Programmable Ramps) Slow (Natural Cooling)
Application Stress Screening / Cycling Baking / Curing

Common Applications

PCB Reliability Thermal cycling of printed circuit boards to identify solder fatigue.
Material Stability Evaluating expansion and moisture absorption of coatings and polymers.
Sensor Testing Verifying sensor performance across extreme temperature ranges.
Accelerated Aging Simulating years of environmental exposure in a condensed timeframe.